Cleaving Tool

The SVTA cleaving tool is designed for cleaving wafers into thin strips/bars in a process chamber. The cleaving tool mounts on a single flange of the process chamber. The tool cleaves wafers into 15mm long by 1mm wide bars, other dimensions are available to fit your system needs. The thin bars are stacked, rotated and placed on a deposition block. The deposition block can then be transferred to a deposition chamber for facet coating of the two cleaved edges or for other deposition processes. The entire process is performed under ultra-high vacuum condition. SVTA will assist you to add the cleaving tool to your existing system configuration.

Contact SVTA for more information.