SVT Associates | MBE Systems

The NorthStar™ ALD (Atomic Layer Deposition) system is a versatile research deposition tool for thermal or energy enhanced ALD. With up to 8 precursor lines and a hot wall deposition chamber, a wide range of applications may be performed from a single system. Sample introduction is rapid and convenient with a quick hatch or the optional load lock. The NorthStar™ ALD system can be interfaced with other deposition and metrology tools. Integration of in-situ metrology tools and the RoboALD software/system automation increases process reproducibility.

Applications
— High k dielectrics
— Nanocoatings
— Surface modification layers
— Device encapsulations
— Photonic crystals

Optional add-on components
— Remote plasma source
— Ozone delivery system
— Quartz crystal monitor
— Quadruple mass spectrometer
— Real-time temperature monitor
— Ellipsometer
— LoadLock

AL2o3_Uniformity

ALD Al₂O₃ film on 4 inch Si wafer
Thickness Non-Uniformity:< 1%
Leakage current <1 nA/cm at 2 MV/cm
Breakdown field: 8 -10 MV/cm
Dielectric constant of as-grown film ~ 8

Specifications Model ALD-P-200B

Gas Manifold
Carrier Gas Line	One for Each Manifold (Typically N₂ ) Mass Flow Control and Controller
Precursor Gas Lines	Precursor Manifolds with 4 Precursors Each (Optional up to 8 Precursors) Fast ALD High Temp Valves (15 msec) Gas Line Heating to 200 C

Process Control
Robo-ALD Process Control	Software and Firmware - PLC Recipe Entry and Operation Logging of parameters - T, P, Flow, (Optional RGA) Based on Labview platform

Load Lock (Optional)
Load Lock Chamber	8” (300mm) Wafer Capacity Removable Top Lid (Hinged) Manual Gate Valve

Contact SVTA

Specifications Model ALD-P-200B

Gas Manifold

Process Control

Load Lock (Optional)